TI Launches Edge AI Radar Sensors and Audio Processors to Redefine In-Cabin Experiences for Automakers

Texas Instruments Unveils Edge AI Radar Sensors and Audio Processors to Revolutionize In-Cabin Automotive Experiences

At CES 2025, Texas Instruments (TI) (Nasdaq: TXN) introduced groundbreaking automotive chips designed to enhance safety and deliver immersive in-cabin experiences across all vehicle price points. The company’s new AWRL6844 60GHz mmWave radar sensor and AM275x-Q1 MCUs and AM62D-Q1 processors are set to redefine how automakers approach safety, audio quality, and overall driver satisfaction. These innovations enable advanced features like occupancy monitoring, child presence detection, intrusion alerts, and premium audio—all while reducing costs for manufacturers.

Edge AI-Enabled Radar Sensor Enhances Safety and Detection Accuracy

Modern vehicles are increasingly equipped with sensors to meet evolving safety standards and improve the driving experience. TI’s AWRL6844 60GHz mmWave radar sensor integrates edge AI capabilities to replace multiple traditional sensor technologies, such as in-seat weight mats and ultrasonic sensors, lowering implementation costs by an average of $20 per vehicle.

The AWRL6844 features four transmitters and four receivers, delivering high-resolution sensing data at an optimized cost for original equipment manufacturers (OEMs). This data is processed through customizable on-chip hardware accelerators and a digital signal processor (DSP), enabling application-specific AI-driven algorithms that improve decision-making accuracy and reduce processing time. Key use cases for this innovative radar sensor include:

  • Occupant Detection and Localization: Achieves 98% accuracy, supporting seat belt reminder systems while driving.
  • Child Presence Detection: Utilizes neural networks to detect micromovements in real-time with over 90% classification accuracy, helping OEMs comply with 2025 Euro NCAP design requirements.
  • Intelligent Intrusion Detection: Adapts to environmental conditions, minimizing false alerts caused by external movement or car shaking when parked.

By consolidating three critical in-cabin sensing functions into a single chip, the AWRL6844 simplifies system design and enhances reliability, making advanced safety features accessible across entry-level to luxury vehicles.

To explore more about how this technology reduces complexity and cost, read TI’s technical article: “Reducing In-Cabin Sensing Complexity and Cost with a Single-Chip 60GHz mmWave Radar Sensor.”

Delivering Premium Automotive Audio with Next-Generation DSP Technology

As consumer expectations for in-cabin audio rise, automakers face the challenge of offering premium sound systems without increasing design complexity or costs. TI addresses this need with its AM275x-Q1 MCUs and AM62D-Q1 processors, which integrate the company’s next-generation C7x DSP core. This innovation delivers over four times the processing performance of competing audio DSPs, enabling engineers to manage multiple audio features within a single core.

Key benefits of TI’s automotive audio solutions include:

  • Scalability: From entry-level to high-end systems, these SoCs allow designers to meet memory and performance needs with minimal redesign and investment.
  • Advanced Audio Features: Support spatial audio, active noise cancellation, sound synthesis, and advanced vehicle networking, including Audio Video Bridging over Ethernet (AVB).
  • Functional Safety: Integrated hardware security modules ensure compliance with modern automotive safety standards.

“Dolby’s longtime collaboration with Texas Instruments has enabled incredible audio experiences in the home, which we’re now bringing into the car,” said Andreas Ehret, Senior Director of Automotive Business at Dolby Laboratories. “With TI’s C7x DSP core, we can now deliver the latest Dolby Atmos capabilities more efficiently, even in smaller form factor audio systems, making immersive entertainment accessible in nearly all vehicles.”

For a complete audio amplifier system, engineers can pair TI’s AM275x-Q1 MCUs and AM62D-Q1 processors with the TAS6754-Q1 Class-D audio amplifier. Featuring innovative 1L modulation technology, the TAS6754-Q1 achieves class-leading audio performance and power efficiency while using half the number of inductors compared to existing Class-D amplifiers. Additionally, the TAS67xx-Q1 family integrates real-time load diagnostics, simplifying designs and reducing costs without compromising audio quality.

Learn more about how TI is transforming in-cabin audio in their blog: “Redefining the Commute: The Advanced Audio Technology Transforming Your Drive.”

Enabling the Future of Automotive Innovation

Today’s drivers expect enhanced in-cabin experiences, regardless of whether they’re driving an entry-level combustion vehicle or a luxury electric model. According to Amichai Ron, Senior Vice President of TI Embedded Processing, “TI continues to provide innovative technologies to enable the future of the automotive driving experience. Our edge AI-enabled radar sensors allow automakers to make vehicles safer and more responsive to the driver, while our audio systems-on-chip elevate the drive through more immersive audio. Together, they create a whole new level of in-cabin experiences.”

TI’s advancements in edge AI and audio processing are part of a broader vision to transform the automotive industry. By integrating these technologies, automakers can offer safer, smarter, and more enjoyable vehicles that cater to the growing demands of modern consumers.

Showcasing Innovations at CES 2025

At CES 2025, held from January 7-10 in Las Vegas, Nevada, TI is showcasing how its semiconductor technologies are reimagining experiences everywhere. Demonstrations include breakthroughs in software-defined vehicles, advanced driver-assistance systems (ADAS), robotics, medical wearables, energy infrastructure, and personal electronics. Visitors can explore the full range of TI’s automotive innovations, including the AWRL6844 radar sensor and audio processors, to see firsthand how these solutions are shaping the future of mobility.

For more information, visit ti.com/CES.

Driving the Future of Automotive Technology

Texas Instruments’ new AWRL6844 radar sensor and AM275x-Q1 MCUs and AM62D-Q1 processors represent a significant leap forward in automotive technology. By integrating edge AI and next-generation DSP capabilities, TI empowers automakers to deliver safer, smarter, and more immersive in-cabin experiences—without compromising affordability. Whether it’s enhancing safety through advanced detection systems or elevating audio quality for a concert-like experience, TI’s innovations are paving the way for a new era of automotive excellence.

Stay tuned for updates as TI continues to lead the charge in transforming the automotive landscape. For more details, explore their official website and discover how these cutting-edge solutions can elevate your next vehicle design.

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