Texas Instruments Unveils Advanced Power Management Chips to Drive Efficiency and Innovation in Modern Data Centers
In response to the rapidly growing power demands of modern data centers, Texas Instruments (TI) (Nasdaq: TXN) has introduced groundbreaking power-management solutions designed to enhance efficiency, scalability, and performance. With the rise of high-performance computing (HPC) and artificial intelligence (AI), data centers require increasingly power-dense and energy-efficient technologies. TI’s latest innovations, including the TPS1685, the industry’s first 48V integrated hot-swap eFuse with power-path protection, and a new family of integrated GaN power stages, are set to redefine how data centers manage power while reducing their environmental impact.
Empowering High-Power Data Centers with Intelligent System Protection
Modern data centers face unprecedented power demands as they scale to support CPUs, GPUs, and AI hardware accelerators. To address these challenges, TI has developed the TPS1685, a 48V stackable integrated hot-swap eFuse that supports power levels beyond 6kW. This cutting-edge solution simplifies design and reduces solution size by half compared to existing hot-swap controllers on the market.
The TPS1685 empowers designers to meet the needs of high-power processing systems while ensuring robust system protection. Its scalable architecture allows for seamless integration into 48V power architectures, which are increasingly adopted for their superior efficiency and scalability. By enabling higher power densities and reducing energy losses, the TPS1685 helps data centers achieve greater sustainability without compromising performance.
To explore how the TPS1685 is transforming power management in AI-driven data centers, read TI’s technical article: “Powering Modern AI Data Centers with an Integrated 48V Hot-Swap eFuse Device.”
Achieving Higher Efficiency with GaN Power Stages in Industry-Standard Packaging
In addition to the TPS1685, TI has introduced a new family of integrated GaN power stages—the LMG3650R035, LMG3650R025, and LMG3650R070—packaged in an industry-standard TOLL format. These devices leverage TI’s advanced gallium nitride (GaN) technology to deliver exceptional efficiency and power density, achieving over 98% efficiency and exceeding 100W/in³ in power density.
Key features of the new GaN power stages include:
- A high-performance gate driver integrated with a 650V GaN field-effect transistor (FET).
- Advanced protection mechanisms such as over-current protection, short-circuit protection, and over-temperature protection.
- Compatibility with existing designs, eliminating the need for costly redesigns.
These innovations are particularly valuable for AC/DC applications like server power supplies, where designers strive to maximize power delivery within compact spaces. By integrating TI’s GaN technology, engineers can achieve higher efficiency and reliability while meeting the stringent demands of modern data centers.
For more insights into how TI’s GaN power stages are revolutionizing power supply design, read the technical article: “Developing Industry-Standard Power Supplies with Integrated TOLL-Packaged GaN Devices.”
Showcasing Innovations at APEC 2025
At the 2025 Applied Power Electronics Conference (APEC), held from March 16-20 in Atlanta, Georgia, TI will demonstrate its latest power solutions that enable designers to reimagine power density and efficiency. Highlights include:
- Dell’s 1.8kW Server PSU: Dell’s first high-efficiency 12V power supply unit leverages TI’s integrated GaN power stage, featuring a GaN FET with built-in driver, protection, and temperature reporting. This design achieves over 96% system-level efficiency.
- Vertiv’s 5.5kW Server PSU: Part of Vertiv’s PowerDirect Rack DC power system, this PSU uses TI GaN technology to deliver up to 132kW per rack, showcasing the scalability and efficiency of TI’s solutions.
- Greatwall’s 8kW PSU: Co-developed with TI, this open-rack PSU combines GaN technology and TI’s C2000™ real-time microcontrollers to push the boundaries of power density.
Throughout the conference, TI’s power experts will lead 27 industry and technical sessions, addressing critical power-management challenges and sharing innovative design strategies. Visit TI at Booth No. 1213 in the Georgia World Congress Center to learn more about these groundbreaking technologies. For the full schedule, visit ti.com/APEC.
Reducing Environmental Impact Through Smart Semiconductors
As data centers increasingly demand more energy, powering the world’s digital infrastructure begins with smarter, more efficient semiconductors. “While advanced chips drive AI’s computational power, analog semiconductors are key to maximizing energy efficiency,” said Robert Taylor, General Manager of Industrial Power Design Services at TI. “Our latest power-management innovations are enabling data centers to reduce their environmental footprint while supporting the growing needs of our digital world.”
TI’s new power-management solutions not only address the immediate challenges of today’s data centers but also pave the way for a more sustainable future. By combining intelligent system protection, GaN technology, and industry-standard packaging, TI is helping designers create power systems that are both efficient and scalable.
Driving Collaboration Across the Industry
TI’s innovations are already making waves among leading technology partners. For example:
- Dell has embraced TI GaN technology to develop its first high-efficiency 12V PSU, setting a new benchmark for server power solutions.
- Vertiv is leveraging TI’s GaN power stages to deliver unprecedented power density in its PowerDirect Rack DC system.
- Greatwall is collaborating with TI to push the limits of power density with an 8kW PSU that integrates GaN and real-time microcontroller technology.
These partnerships demonstrate the versatility and impact of TI’s power-management solutions across the industry.
Pioneering the Future of Data Center Power Management
Texas Instruments’ latest advancements in power management are poised to revolutionize modern data centers. From the TPS1685 eFuse to the LMG3650R GaN power stages, TI’s innovations deliver unmatched efficiency, scalability, and reliability. By enabling designers to tackle the growing power demands of AI and HPC workloads, TI is driving the evolution of data center infrastructure while promoting sustainability.
Stay tuned for updates as TI continues to lead the charge in power-management innovation. For more information, visit ti.com and explore how these cutting-edge solutions can elevate your next power design.
About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, personal electronics, enterprise systems and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.
