YES Delivers Multiple VertaCure LX Systems to Taiwan’s Leading OSAT Provider, Strengthening Leadership in Advanced Packaging
Yield Engineering Systems (YES), a premier provider of process equipment for AI and high-performance computing (HPC) semiconductor applications, has announced the successful delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers. These cutting-edge systems will support advanced packaging processes critical to Edge Computing and HPC solutions, offering low-temperature curing, annealing, and degassing capabilities for applications such as Wafer-Level Chip Scale Packaging (WLCSP), Plated Bump, and Copper (Cu) Pillar technologies.
The VertaCure LX is a fully automated vacuum curing and degassing system designed to meet the stringent demands of modern semiconductor manufacturing. Engineered with precision, the system ensures uniform temperature distribution and meticulous control over heating and cooling rates. This level of precision results in complete solvent removal, enhanced film properties, elimination of outgassing post-cure, and exceptional particle performance—key factors in ensuring the reliability and performance of advanced semiconductor packages.
A Proven Solution for High-Volume Manufacturing
The VertaCure LX has quickly become a cornerstone of YES’s portfolio, earning widespread adoption as the industry’s leading high-volume manufacturing (HVM) curing solution for 2.5D packaging. Its ability to deliver consistent mechanical, thermal, and electrical performance across wafer-level, 2.5D, and 3D packaging applications has been validated by leading integrated device manufacturers (IDMs) and foundries worldwide. With this latest delivery to a prominent OSAT provider, YES continues to expand its footprint in the advanced packaging market.
“The VertaCure family has become the industry’s most widely adopted HVM curing solution for 2.5D packaging,” said Rezwan Lateef, President of YES. “These systems have consistently demonstrated superior performance across a wide range of applications, from wafer-level packaging to complex 3D architectures. The endorsement from leading IDMs and foundries underscores the platform’s reliability and effectiveness. Now, with growing demand from OSAT customers, we are further solidifying our leadership in advanced packaging.”
Enhancing Thermal Uniformity and Reducing Costs
One of the standout features of the VertaCure LX is its ability to deliver more than 30% improvement in thermal uniformity compared to traditional curing systems. This enhancement not only improves process outcomes but also contributes to higher yields and better product quality. Additionally, the system offers a 30% reduction in the cost of ownership, making it an attractive choice for high-volume manufacturing environments where efficiency and cost-effectiveness are paramount.
Alex Chow, Senior Vice President of Sales and Business Development and Asia President at YES, emphasized the significance of this milestone: “The VertaCure LX systems represent a major leap forward in curing technology for advanced packaging. With their superior thermal uniformity and lower cost of ownership, these systems are setting new standards in the industry. We anticipate follow-on and volume purchase orders from this customer in 2026, reflecting the growing trust and reliance on YES as the go-to provider for curing solutions.”
Meeting the Demands of Edge Computing and HPC
As the semiconductor industry continues to push the boundaries of innovation, the demand for advanced packaging solutions tailored to Edge Computing and HPC applications is surging. These technologies require highly reliable and efficient processes to ensure optimal performance under demanding conditions. The VertaCure LX addresses these needs by providing precise control over critical parameters such as temperature, pressure, and time, enabling manufacturers to achieve consistent and repeatable results.
Edge Computing, which involves processing data closer to the source of generation, requires compact yet powerful semiconductor packages that can operate efficiently in diverse environments. Similarly, HPC solutions demand high-performance chips capable of handling massive computational workloads. The VertaCure LX plays a vital role in enabling these advancements by supporting the production of advanced packages that meet the rigorous requirements of these applications.
Strengthening Market Leadership
This shipment of VertaCure LX systems to Taiwan’s leading OSAT provider marks another milestone in YES’s journey toward market leadership in curing technology. By delivering innovative solutions that address the evolving needs of the semiconductor industry, YES has established itself as a trusted partner for both R&D and high-volume manufacturing environments. The company’s commitment to quality, precision, and customer satisfaction has been instrumental in driving its success.
The adoption of the VertaCure LX by a top-tier OSAT provider underscores the growing recognition of YES’s expertise in advanced packaging. As the semiconductor industry continues to evolve, YES is well-positioned to capitalize on emerging opportunities and maintain its competitive edge.
About YES
YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.
