Eaton Unveils Next-Generation Architecture to Accelerate 800 VDC Power Adoption for AI Data Centers
In a groundbreaking move set to redefine the landscape of artificial intelligence (AI) data centers, Eaton, a global leader in intelligent power management, has announced the delivery of a new reference architecture designed to accelerate the adoption of 800 VDC power infrastructure. This innovative design, developed in collaboration with NVIDIA, leverages Eaton’s cutting-edge power management technologies to address the escalating energy demands of high-density computing environments in AI factories. The announcement marks a significant milestone in Eaton’s grid-to-chip strategy, which aims to optimize and future-proof AI data centers by providing seamless, efficient, and scalable power solutions.
Meeting the Growing Energy Demands of AI
The exponential growth of AI workloads has placed unprecedented pressure on data center infrastructure. As AI applications become more complex, they require increasingly powerful computing systems that push the limits of traditional power architectures. To meet these challenges, NVIDIA is spearheading efforts alongside leading power, silicon, and data center partners to pioneer the adoption of 800 VDC power systems. These next-generation systems integrate advanced power distribution with energy storage, enabling them to deliver megawatt-scale rack power safely, efficiently, and with minimal material and infrastructure costs.
Eaton’s new reference architecture plays a pivotal role in this initiative by providing a blueprint for deploying 800 VDC power in AI data centers. By combining innovative power management solutions with NVIDIA’s AI infrastructure, Eaton’s design ensures that AI factories can scale effectively while maximizing energy efficiency and minimizing operational costs.
Key Components of Eaton’s Reference Design
Eaton’s reference architecture incorporates a range of advanced products and technologies tailored to support the unique demands of AI data centers. Key components include:
- Supercapacitors for Fast-Cycle Power Backup: These devices provide rapid-response backup power, ensuring uninterrupted operation during transient power events.
- Power Distribution via Busbar Systems: Eaton’s busbar technology, integrated into the ORV3 design, enables efficient and reliable power distribution across high-density computing environments.
- Hot Aisle Containment Systems: These systems support busway and cable tray installations, optimizing airflow and thermal management within the data center.
- DC Connectors and Advanced Power Management Solutions: Eaton’s connectors and digital technologies enhance the reliability and efficiency of 800 VDC power systems, ensuring compatibility with modern AI infrastructure.
“The introduction of 800 VDC architectures is a transformative advancement for data center innovation that will enable new possibilities in AI computing,” said JP Buzzell, Vice President and Data Center Chief Architect at Eaton. “We’re proud to deepen our collaboration with NVIDIA with the introduction of this new reference design, a major step in our grid-to-chip strategy, as we help accelerate the transition to the AI factory of the future.”
Eaton’s Grid-to-Chip Strategy: Powering the AI Industrial Age
Eaton’s grid-to-chip strategy represents a comprehensive approach to addressing the full spectrum of power management needs in AI data centers. From power distribution and backup systems to advanced digital technologies, Eaton’s solutions are designed to protect and optimize high-density computing environments while supporting the growing energy demands of AI workloads.
Recent advancements in Eaton’s strategy include:
- Collaboration with Siemens Energy: Eaton is working with Siemens Energy to support the fast construction of modular data centers equipped with integrated on-site power generation. This partnership accelerates the deployment of sustainable and scalable data center solutions.
- Proactive AI Power Bursting Mitigation: Eaton has introduced an edge-based solution capable of detecting and mitigating AI power bursting in real-time, ensuring stable and reliable operations in high-density environments.
“Streamlined 800 VDC architectures enable AI infrastructure to meet rising workload demands while maximizing energy efficiency,” said Dion Harris, Senior Director of HPC, Cloud, and AI Infrastructure at NVIDIA. “NVIDIA’s collaboration with innovators like Eaton is paving the way for high-density computing environments built for the AI industrial age.”
Showcasing Innovation at the Open Compute Project Global Summit
Eaton will showcase its latest developments for the 800 VDC architecture at the Open Compute Project (OCP) Global Summit, taking place from October 13-16, 2025, in San Jose, California. Attendees visiting Eaton’s booth (A15) will have the opportunity to explore how the company’s power management solutions are driving innovation in AI data centers. From supercapacitors to advanced busbar systems, Eaton’s exhibits will highlight the critical role of intelligent power management in enabling the AI factories of tomorrow.
A Commitment to Sustainability and Innovation
As an intelligent power management company, Eaton is dedicated to protecting the environment and improving quality of life through sustainable innovation. Its products serve a wide range of industries, including data centers, utilities, industrial, commercial, residential, aerospace, and mobility markets. Guided by a commitment to operate sustainably and help customers manage power effectively, Eaton is capitalizing on global trends in electrification and digitalization to address the world’s most urgent power management challenges.
By advancing 800 VDC power infrastructure, Eaton is not only helping AI data centers meet current demands but also future-proofing them for the challenges of tomorrow. As AI continues to reshape industries, Eaton’s solutions ensure that data centers remain at the forefront of innovation, delivering unparalleled performance, efficiency, and scalability.
