GUC and Ayar Labs Join Forces to Propel Co-Packaged Optics for Hyperscale AI and HPC Applications
In a groundbreaking move set to redefine the future of artificial intelligence (AI), high-performance computing (HPC), and networking, Global Unichip Corp. (GUC), a leader in advanced ASIC design services, has announced a strategic partnership with Ayar Labs, a pioneer in co-packaged optics (CPO) for large-scale AI workloads. This collaboration aims to integrate Ayar Labs’ cutting-edge optical engines into GUC’s advanced ASIC design and packaging workflows, addressing the growing need for high-bandwidth, low-latency, and power-efficient interconnects in next-generation applications.
As the demand for computational power continues to surge, traditional electrical signaling is reaching its limits, creating bottlenecks in data transfer and efficiency. To overcome these challenges, the partnership between GUC and Ayar Labs focuses on embedding Ayar Labs’ TeraPHY™ optical engines directly into GUC’s multi-chip package (MCP) designs. This integration marks a significant step forward in enabling co-packaged optics (CPO), a transformative technology that promises to revolutionize hyperscale data centers and AI systems.
A Leap Forward in Optical Interconnects
The integration of Ayar Labs’ TeraPHY™ optical engines into GUC’s advanced packaging solutions represents a paradigm shift in how data is transmitted within and between chips. By replacing traditional electrical interconnects with optical interfaces, the new XPU MCP design achieves an unprecedented full-duplex optical interface of over 100 Tbps from the XPU package—a tenfold improvement over current capabilities. This leap in bandwidth not only enhances performance but also significantly reduces power consumption, making it ideal for hyperscale AI and HPC applications.
Igor Elkanovich, CTO of GUC, emphasized the importance of this collaboration: “The CPO revolution is at our doorstep. Integrating Ayar Labs’ optical engines into our advanced packaging flows is a critical step. Our joint design addresses multiple challenges—architectural, power and signal integrity, mechanical, and thermal—ensuring that our customers have access to a robust, high-bandwidth, and power-efficient solution.”
Addressing Key Challenges in CPO Integration
The new XPU MCP design leverages advanced technologies to address the complex challenges associated with co-packaged optics. For instance, UCIe-S (64 Gbps) facilitates communication between the optical engines and I/O chiplets over the MCP substrate, while UCIe-A (64 Gbps) enables seamless interaction between the I/O chiplet and the main AI die via local silicon interconnect (LSI) bridges. These innovations ensure optimal bandwidth and minimal latency, even in large-scale packages.
Thermal optimization is another critical aspect of the design. The XPU MCP incorporates thermal management strategies at the package level, ensuring efficient heat dissipation without compromising performance. Additionally, a newly developed stiffener design accommodates the unique requirements of optical engines, including detachable fiber connections, while meeting stringent mechanical stress and warpage standards.
Enabling the Future of AI and Data Centers
The partnership between GUC and Ayar Labs underscores the critical role of optics in overcoming the limitations of electrical I/O. As AI models grow in complexity and data center workloads expand, the ability to scale efficiently becomes paramount. Traditional electrical signaling struggles to keep pace with these demands, leading to bottlenecks that hinder progress. Co-packaged optics offers a viable solution by enabling faster, more energy-efficient data transfer.
Vladimir Stojanovic, CTO and co-founder of Ayar Labs, highlighted the significance of this collaboration: “The future of AI and data center scale-up will not be possible without optics to overcome the electrical I/O bottleneck. Working with GUC on advanced packaging and silicon technologies is an important step in demonstrating how our optical engines can accelerate the implementation of co-packaged optics for hyperscalers and AI scale-up.”
Showcasing Innovations at TSMC OIP Forum
GUC plans to share further insights into these technological advancements during a presentation titled “Advanced Packaging Technologies for Modular and Powerful Compute” at the 2025 TSMC Open Innovation Platform (OIP) Ecosystem Forum. Scheduled for Tuesday, November 18, 2025, in Hsinchu, Taiwan, the event will provide a platform for GUC to showcase its breakthroughs in co-packaged optics and advanced packaging technologies.
This presentation will offer attendees a deeper understanding of how GUC and Ayar Labs are working together to address the challenges of integrating optical engines into ASIC designs. By demonstrating their joint efforts, the companies aim to inspire confidence among hyperscalers and other stakeholders in the potential of co-packaged optics to drive the next wave of innovation in AI and HPC.
A Vision for the Future
The collaboration between GUC and Ayar Labs represents a pivotal moment in the evolution of semiconductor technology. By combining GUC’s expertise in advanced ASIC design and packaging with Ayar Labs’ leadership in co-packaged optics, the partnership is poised to deliver transformative solutions that meet the demands of tomorrow’s hyperscale AI and HPC applications.
As the industry moves toward a future where data transfer speeds and energy efficiency are paramount, co-packaged optics stands out as a key enabler of progress. With their shared commitment to innovation, GUC and Ayar Labs are paving the way for a new era of computing—one where the boundaries of performance are pushed further than ever before.
About GUC (Global Unichip Corp.)
GLOBAL UNICHIP CORP. (GUC) is the Advanced ASIC Leader who provides the semiconductor industry with leading IC implementation and SoC manufacturing services, using advanced process and packaging technology. Based in Hsinchu, Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, North America, and Vietnam. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443. TSMC is GUC’s single largest shareholder who holds 35% of the company’s total shares. TSMC is also GUC’s sole foundry supplier as well as the closest partner in advanced process and packaging technologies.
For more information, visit: www.guc-asic.com
About Ayar Labs
Ayar Labs, a leader in optical engines for co-packaged optics, is transforming AI infrastructure by accelerating data movement in scale-up networks. Its industry-first optical I/O solution enables customers to maximize compute efficiency and performance while reducing costs, latency, and power consumption. Based on open standards and optimized for AI training and inference, Ayar Labs’ optical interconnect solutions are backed by a robust ecosystem to easily integrate into AI systems at scale. Ayar Labs was founded in 2015 and is funded by domestic and international venture capital firms, as well as strategic investors including AMD, Applied Ventures, Hewlett Packard Pathfinder, Intel Capital, and NVIDIA. For more information, visit www.ayarlabs.com
