GigaDevice Unveils GD25NX Series: High-Performance Dual-Voltage xSPI NOR Flash for Next-Generation Applications
GigaDevice, a leading innovator in semiconductor solutions specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, has announced the launch of its latest breakthrough product line: the GD25NX series of high-performance dual-voltage xSPI NOR Flash. This new series combines a 1.8 V core with a 1.2 V I/O design, enabling direct connectivity to 1.2 V system-on-chips (SoCs) without the need for an external booster circuit. This innovation not only reduces system power consumption but also lowers the bill of materials (BOM) cost, making it an ideal solution for applications requiring exceptional stability, responsiveness, and energy efficiency.
Building on the success of its predecessors—the 1.2 V I/O GD25NF and GD25NE series—the GD25NX series represents a significant leap forward in GigaDevice’s expertise in dual-voltage Flash design. With its high-speed data transfer capabilities, enhanced reliability, and outstanding power efficiency, the GD25NX is perfectly suited for demanding applications such as wearables, data centers, edge AI, and automotive electronics.
High-Speed Performance Meets Reliability
The GD25NX series supports an octal SPI interface, achieving a maximum clock frequency of 200 MHz in both single transfer rate (STR) and double transfer rate (DTR) modes. This enables data throughput of up to 400 MB/s, setting a new standard for speed in NOR Flash memory. Furthermore, the series offers a typical page program time of 0.12 ms and a sector erase time of 27 ms—30% faster programming speeds and 10% shorter erase times compared to conventional 1.8 V octal Flash products.
To ensure data integrity and extend product lifespan, the GD25NX series integrates advanced error correction code (ECC) algorithms and cyclic redundancy check (CRC) verification. These features enhance data reliability, making the devices robust enough for mission-critical applications. Additionally, the series includes data strobe (DQS) functionality, which ensures signal integrity during high-speed data transfers—a crucial requirement for SoCs used in data centers and automotive systems.
Power Efficiency at Its Core
One of the standout features of the GD25NX series is its innovative 1.2 V I/O architecture, which delivers remarkable power efficiency while maintaining high-speed operation. At a frequency of 200 MHz, the device achieves read currents as low as 16 mA in Octal I/O STR mode and 24 mA in Octal I/O DTR mode. Compared to traditional 1.8 V Octal I/O SPI NOR Flash devices, the 1.2 V I/O design reduces read power consumption by up to 50%. This dramatic improvement in energy efficiency makes the GD25NX series an excellent choice for power-sensitive applications, including wearables and battery-operated IoT devices.
Ruwei Su, Vice President and General Manager of Flash BU at GigaDevice, emphasized the significance of this advancement: “The GD25NX series sets a new benchmark for combining low voltage with high performance in SPI NOR Flash. Its design aligns closely with mainstream SoC requirements for low-voltage interfaces, enabling higher integration and lower BOM costs for customers. Moving forward, GigaDevice will continue to expand its dual-voltage portfolio with broader density and package options to help customers build the next generation of efficient and reliable low-power storage solutions.”
Versatile Storage Solutions for Diverse Applications
The GD25NX series is available in densities of 64 Mb and 128 Mb, catering to a wide range of storage needs across various industries. These devices are offered in compact TFBGA24 8×6 mm (5×5 ball array) and WLCSP (4×6 ball array) packages, ensuring flexibility for space-constrained designs. Samples of the 128 Mb GD25NX128J are now available for customer evaluation, while samples of the 64 Mb GD25NX64J are currently being prepared. For detailed technical information or pricing inquiries, customers can reach out to their local authorized GigaDevice sales representatives.
Enabling Next-Generation Innovations
The GD25NX series addresses the growing demand for high-performance, energy-efficient memory solutions in cutting-edge applications. Wearable devices benefit from the series’ low power consumption, enabling longer battery life without compromising on performance. In data centers, the combination of high-speed data transfer and signal integrity ensures seamless operations even under heavy workloads. For edge AI applications, the GD25NX series provides the fast, reliable storage needed to support real-time decision-making. Meanwhile, in automotive electronics, the series’ robust reliability and low power consumption make it an excellent fit for modern vehicles equipped with advanced driver-assistance systems (ADAS) and infotainment systems.
A Commitment to Innovation and Customer Success
With the introduction of the GD25NX series, GigaDevice reaffirms its commitment to pushing the boundaries of semiconductor technology. By offering dual-voltage designs that align with the evolving needs of SoCs, GigaDevice empowers customers to achieve higher levels of integration, reduce costs, and improve overall system efficiency. The company’s focus on expanding its dual-voltage portfolio underscores its dedication to providing versatile, future-proof solutions that meet the demands of tomorrow’s technology landscape.
As industries continue to embrace digital transformation, the need for advanced memory solutions that balance performance, reliability, and power efficiency becomes increasingly critical. The GD25NX series exemplifies GigaDevice’s ability to deliver cutting-edge innovations that address these challenges head-on. By enabling customers to build more efficient and reliable systems, GigaDevice is helping pave the way for the next generation of technological advancements.
About GigaDevice
GigaDevice Semiconductor Inc. is a global leading fabless supplier. Founded in April 2005, the company has continuously expanded its international footprint and established its global headquarters in Singapore in 2025. Today, GigaDevice operates branch offices across numerous countries and regions, providing localized support at customers’ fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com
