Global Experts Gather to Advance Semiconductor Device Modeling
In the rapidly evolving landscape of semiconductor technology, the need for cutting-edge device modeling is more critical than ever. The Si2 Compact Model Coalition, IEEE, and IEEE EDS are stepping up to the challenge by sponsoring the second edition of the International Compact Modeling Conference (ICMC). This two-day in-person event, set for July 30-31, 2026, at the Queen Mary in Long Beach, California, will bring together global experts to discuss advancements in semiconductor device modeling.
The paper submission deadline has been extended to March 2, 2026, providing researchers and practitioners more time to contribute to the evolution of device models. “This extension ensures that we can gather the most comprehensive and innovative research in the field,” said a spokesperson from the Si2 Compact Model Coalition.
Key Insights at a Glance
- Conference Date: The ICMC 2026 will be held from July 30-31, 2026.
- Submission Deadline: The paper submission deadline has been extended to March 2, 2026.
- Highlighted Themes: Electrostatic Discharge (ESD) modeling, reliability and aging-aware compact models, and AI or Machine Learning for model development.
- Location: The conference will take place at the Queen Mary in Long Beach, California.
Why Advanced Device Modeling Is Crucial for Semiconductor Innovation
Just as a well-orchestrated symphony requires precise tuning, the advancement of semiconductor technology relies heavily on accurate and reliable device models. The Si2 Compact Model Coalition, IEEE, and IEEE EDS are addressing the critical need for innovation in this field. By bringing together experts from design, process technology, and model development, the ICMC 2026 aims to foster collaboration and drive progress. The conference’s focus on Electrostatic Discharge (ESD) modeling, reliability and aging-aware compact models, and AI or Machine Learning for model development underscores the industry’s commitment to addressing current and future challenges. The extended submission deadline ensures that the conference will feature the latest and most innovative research, creating a sense of urgency for participation.
Why the Window for Action Is Closing Fast
Like a sprinter preparing for the final leg of a race, the semiconductor industry must act swiftly to stay ahead of the competition. The extended paper submission deadline for the ICMC 2026 is a critical opportunity for researchers and practitioners to share their insights and innovations. The conference’s focus on cutting-edge themes such as ESD modeling, reliability and aging-aware compact models, and AI or Machine Learning for model development highlights the industry’s need for immediate action. With the deadline now set for March 2, 2026, the clock is ticking for those who wish to contribute to the advancement of semiconductor device modeling.
Si2 Compact Model Coalition Mobilizes Global Experts for ICMC 2026
The Si2 Compact Model Coalition, IEEE, and IEEE EDS are mobilizing global experts to participate in the ICMC 2026. This two-day in-person event, scheduled for July 30-31, 2026, at the Queen Mary in Long Beach, California, will serve as a platform for sharing the latest advancements in semiconductor device modeling. Researchers and practitioners are invited to submit their papers by the extended deadline of March 2, 2026. The conference will cover a range of topics, including Electrostatic Discharge (ESD) modeling, reliability and aging-aware compact models, and AI or Machine Learning for model development. Corporate sponsors such as Cadence, Keysight, Micron, Qualcomm, Sandia National Laboratories, Siemens, Synopsys, and TSMC, along with media sponsors SemiWilki and Semiconductor Digest, are supporting this important event. Si2 Compact Model Coalition is committed to fostering collaboration and innovation in the semiconductor industry, ensuring that the ICMC 2026 will be a pivotal moment for global experts.
Future Outlook
The ICMC 2026 is like a lighthouse guiding the semiconductor industry towards a future of advanced and reliable device models. By extending the paper submission deadline, the organizers are ensuring that the conference will feature the most cutting-edge research and insights. The event’s focus on critical themes such as ESD modeling, reliability and aging-aware compact models, and AI or Machine Learning for model development underscores the industry’s commitment to innovation. With the conference just around the corner, the stage is set for a transformative gathering of global experts.
Conclusion
The ICMC 2026, organized by the Si2 Compact Model Coalition, IEEE, and IEEE EDS, represents a significant step forward in the advancement of semiconductor device modeling. By extending the paper submission deadline and focusing on critical themes, the conference is poised to drive innovation and collaboration in the industry. Join the conversation in the comments below.
About Si2
The Silicon Integration Initiative Inc. is a global, not-for-profit membership organization with approximately 70 corporate members who collaborate on trusted standards and shared solutions that reduce development costs and increase design productivity for semiconductor foundries, fabless design companies, and EDA software providers. Learn more at https://si2.org/.
About IEEE
IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. Learn more at https://www.ieee.org/.
About IEEE EDS
EDS fosters the professional growth of its members by satisfying their needs for easy access to and exchange of technical information, publishing, education, and technical recognition and enhancing public visibility in the field of Electron Devices. Learn more at https://eds.ieee.org/.
