Category Research

Synopsys Boosts Hardware Verification Portfolio for Next-Gen Semiconductor Innovation

Synopsys Expands Hardware-Assisted Verification Portfolio with AMD-Powered HAPS-200 and ZeBu-200 Systems for Next-Gen Semiconductor Design Synopsys, Inc. (Nasdaq: SNPS) has announced a major expansion of its industry-leading hardware-assisted verification (HAV) portfolio with the launch of the next-generation HAPS-200 prototyping and…

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Cadence and NVIDIA Grace Blackwell: Accelerating AI-Driven Design and Science

Cadence and NVIDIA Blackwell: Revolutionizing AI-Driven Engineering and Science with Up to 80X Acceleration In a groundbreaking collaboration, Cadence (Nasdaq: CDNS) and NVIDIA are pushing the boundaries of accelerated computing and agentic AI to address critical global technology challenges. By…

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MediaTek Boosts 2nm Chip Design with AI-Driven Cadence Tools on NVIDIA Platform

MediaTek Accelerates 2nm Chip Design with AI-Driven Cadence Virtuoso Studio and Spectre X on NVIDIA Platform In the ever-evolving semiconductor industry, staying ahead of the curve is critical for success. MediaTek, a global leader in advanced system-on-chip (SoC) solutions, has…

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Fortinet Enhances OT Security Platform to Safeguard Critical Infrastructure Against Evolving Threats

Fortinet Advances OT Security Platform to Strengthen Protection for Critical Infrastructure Fortinet® (NASDAQ: FTNT), the global leader in cybersecurity driving the convergence of networking and security, has announced significant advancements to its Operational Technology (OT) Security Platform. These updates are…

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Marvell Showcases Industry-Leading 2nm Silicon Technology to Revolutionize Accelerated Infrastructure

Marvell Unveils Industry-Leading 2nm Silicon Platform to Revolutionize AI and Cloud Infrastructure Marvell Technology, Inc. (NASDAQ: MRVL), a global leader in data infrastructure semiconductor solutions, has announced the successful demonstration of its first 2nm silicon intellectual property (IP) for next-generation…

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Marvell Unveils Revolutionary Co-Packaged Optics Architecture to Power Custom AI Accelerators

Marvell Unveils Breakthrough Co-Packaged Optics (CPO) Architecture for Custom AI Accelerators: Revolutionizing AI Server Performance Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, has announced a groundbreaking advancement in its custom AI accelerator (XPU) architecture with…

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SK hynix Achieves Industry-First ‘TISAX’ Certification: Setting a New Standard in Memory Security and Compliance

SK hynix Achieves Industry-First TISAX Certification: Pioneering Security Standards in the Memory Sector SK hynix Inc. (www.skhynix.com) has made history by becoming the first company in the memory industry to achieve TISAX (Trusted Information Security Assessment Exchange) certification, a globally…

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Intel Showcases AI PC and Edge Computing Leadership at CES 2025: Driving Innovation and Performance

Intel Unveils Intel® Core™ Ultra (Series 2) Processors: Redefining Mobile Computing for Businesses, Creators, and Gamers At CES 2025, Intel unveiled its highly anticipated Intel® Core™ Ultra (Series 2) processors, setting a new standard for mobile computing. Designed to meet…

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Analog Devices Unveils Enhanced CodeFusion Studio™ to Streamline Product Development and Boost Data Security

Analog Devices Expands CodeFusion Studio™ and Introduces Data Provenance Solution to Accelerate Development and Enhance Data Security Analog Devices, Inc. (Nasdaq: ADI), a global leader in semiconductor technology, has announced the expansion of its developer-centric offerings with two groundbreaking solutions…

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Lam Research Revolutionizes Semiconductor Metallization with ALTUS® Halo for Molybdenum ALD

Lam Research Introduces ALTUS® Halo: Revolutionizing Semiconductor Metallization with Molybdenum ALD In a groundbreaking advancement for the semiconductor industry, Lam Research Corp. (Nasdaq: LRCX) has unveiled ALTUS® Halo, the world’s first atomic layer deposition (ALD) tool designed to harness the…

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Lam Research Introduces Breakthrough Conductor Etch Technology, Setting New Industry Standards

Lam Research Unveils Akara: The Industry’s Most Advanced Conductor Etch Technology for 3D Chipmaking In a groundbreaking move to address the semiconductor industry’s toughest scaling challenges, Lam Research Corp. (Nasdaq: LRCX) has introduced Akara®, the most advanced conductor etch tool…

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