HyperLight Launches TFLN Chiplet™ Platform: Revolutionizing Photonics with Scalable 6-Inch Production and 8-Inch Expansion
In a groundbreaking move set to redefine the photonics industry, HyperLight, the leader in thin-film lithium niobate (TFLN) technology, has unveiled its TFLN Chiplet™ platform. This modular and scalable ecosystem is designed to power next-generation advancements in photonics, artificial intelligence (AI), telecommunications, quantum computing, and beyond. Built on the industry’s first and only high-volume, qualified 6-inch TFLN manufacturing line—now complemented by an 8-inch pilot line for future compatibility—the platform establishes a new benchmark for scalable, high-performance optical systems.
A New Era of Industrial-Grade Photonics
The TFLN Chiplet™ platform combines industrial readiness with technological superiority, offering volume-ready solutions that unify wafer-scale fabrication, testing, and integration. Backed by over a decade of intensive R&D and supported by more than 70 pivotal patents (both pending and granted), HyperLight ensures its partners have access to cutting-edge innovations while providing a stable foundation for long-term product roadmaps.
“For us, this isn’t just a technology launch—it’s the culmination of more than ten years of R&D and platform refinement with our partners and the ecosystem,” said Mian Zhang, CEO of HyperLight. “The TFLN Chiplet™ platform is built for today’s industrial scale, evolves with the market, and is designed to align with our partners’ and the ecosystem’s long-term success.”
Meeting the Demands of Modern Applications
The TFLN Chiplet™ platform is engineered to address the diverse and evolving demands of today’s most advanced applications. Here’s how it delivers across key industries:
- AI and Data Communications:
As AI workloads and data center demands surge, the platform supports scalable, reliable, low-power, high-bandwidth components enabled by HyperLight’s high-volume production line. Its exceptional electro-optic performance ensures energy-efficient, high-speed data transfer critical for AI infrastructure. - Telecommunications:
In telecom, where reliability, signal integrity, and speed are paramount, the platform’s best-in-class electro-optic performance, coupled with rigorous Telcordia qualification, provides unmatched advantages. It ensures consistent, high-quality performance even in the most demanding environments. - Precision Test and Measurement:
For precision measurement applications, meticulous calibration, tight process control, and rigorous quality assurance ensure confidence in high-stakes environments. The platform’s ultra-low optical loss capabilities make it ideal for applications requiring extreme accuracy. - Quantum Computing and Emerging Technologies:
The platform’s exceptionally low optical loss enables unprecedented functionalities, making it a game-changer for quantum computing and other emerging domains. Its ability to support cutting-edge research positions HyperLight as a foundational supplier for future innovations.
Scalability and Forward Compatibility
At the heart of the TFLN Chiplet™ platform is HyperLight’s 6-inch high-volume production line, which serves as the cornerstone of its commercial manufacturing capabilities. This line provides the scale, maturity, and reliability required for immediate deployment in today’s market. Looking ahead, HyperLight has introduced an 8-inch pilot line to ensure forward compatibility with future integration and packaging standards. This strategic expansion positions the company as a key enabler of next-generation photonic systems, capable of meeting the growing demands of AI, datacom, quantum, and beyond.
The platform’s modular, application-focused building blocks accelerate time-to-market and innovation across industries. By streamlining design, development, and deployment processes, HyperLight empowers its partners to focus on delivering transformative solutions without compromising on performance or scalability.
Unmatched Technological Leadership
HyperLight’s unique combination of thin-film lithium niobate (TFLN) technology with scalable CMOS-compatible manufacturing processes sets it apart from competitors. TFLN’s superior electro-optic properties enable unprecedented bandwidth, ultra-low loss, and exceptional energy efficiency. These attributes make the TFLN Chiplet™ platform a versatile solution for a wide range of applications, from high-speed data centers to cutting-edge quantum experiments.
By leveraging its deep expertise and patented innovations, HyperLight provides partners with the tools they need to stay ahead in an increasingly competitive landscape. The platform not only meets current industry requirements but also anticipates future needs, ensuring long-term relevance and adaptability.
Empowering Breakthrough Innovations
Headquartered in Cambridge, Massachusetts, HyperLight is at the forefront of integrated photonics solutions. The company’s mission is to empower groundbreaking innovations in AI, data centers, telecommunications, quantum computing, and emerging technologies through its TFLN Chiplet™ platform. By bridging the gap between cutting-edge research and scalable manufacturing, HyperLight is driving the next wave of technological progress.
To learn more about the transformative capabilities of HyperLight’s TFLN Chiplet™ platform and how it can elevate your organization’s photonics initiatives, visit hyperlightcorp.com.
Why the TFLN Chiplet™ Platform Matters
As industries continue to push the boundaries of what’s possible, the demand for scalable, high-performance optical systems has never been greater. HyperLight’s TFLN Chiplet™ platform addresses this need head-on, offering a rare combination of industrial-grade scalability and technological leadership. Whether it’s powering AI-driven data centers, enabling ultra-fast telecommunications, or advancing quantum computing research, the platform is designed to meet the challenges of today while paving the way for tomorrow’s breakthroughs.
With its robust 6-inch production line and forward-looking 8-inch pilot line, HyperLight is setting a new standard for photonics manufacturing. By providing partners with access to the best TFLN innovations and ensuring freedom to operate, the company is empowering the ecosystem to innovate faster, scale smarter, and achieve more.
For organizations seeking to harness the full potential of photonics, HyperLight’s TFLN Chiplet™ platform represents a transformative opportunity—one that promises to unlock new possibilities and drive meaningful progress across industries.
