Marvell Unveils Industry-Leading 2nm Silicon Platform to Revolutionize AI and Cloud Infrastructure
Marvell Technology, Inc. (NASDAQ: MRVL), a global leader in data infrastructure semiconductor solutions, has announced the successful demonstration of its first 2nm silicon intellectual property (IP) for next-generation AI and cloud infrastructure. Produced using TSMC’s cutting-edge 2nm process, this breakthrough positions Marvell as a pioneer in enabling hyperscalers and cloud service providers to dramatically enhance the performance, efficiency, and economic potential of their global operations.
As the demand for accelerated compute grows exponentially, custom silicon is projected to account for approximately 25% of the market by 2028, with an estimated annual total addressable market (TAM) growth rate of 45%. This underscores the critical role of advanced semiconductor platforms like Marvell’s 2nm solution in driving innovation across AI accelerators, CPUs, networking, and other critical technologies.
A Building Block Approach to Custom Silicon Development
Marvell’s platform strategy revolves around creating a comprehensive portfolio of semiconductor IP that serves as the foundation for developing custom AI accelerators (XPUs), CPUs, switches, and other advanced technologies. These building blocks include:
- High-speed electrical and optical serializer/deserializer (SerDes): Enabling ultra-fast data transfer rates.
- Die-to-die interconnects for 2D and 3D devices: Facilitating seamless communication between stacked chiplets.
- Advanced packaging technologies: Supporting complex, high-density designs.
- Silicon photonics: Delivering efficient, high-bandwidth optical interconnects.
- Custom high-bandwidth memory (HBM) compute architecture: Optimizing memory performance for AI workloads.
- On-chip static random-access memory (SRAM): Enhancing processing speed and efficiency.
- System-on-chip (SoC) fabrics and compute fabric interfaces: Including PCIe Gen 7 for next-gen connectivity.
This modular approach allows Marvell and its customers to accelerate the development of custom solutions tailored to the unique demands of AI, cloud computing, and networking.
Pioneering Advanced Technology Leadership
Since launching the industry’s first 5nm data infrastructure silicon platform in 2020, Marvell has consistently pushed the boundaries of semiconductor innovation. In 2022, the company introduced the industry’s leading 3nm platform, with first silicon produced in 2023. Multiple products based on this platform are now shipping or in development, underscoring Marvell’s leadership in leveraging advanced process nodes.
“The platform approach enables us to accelerate the development of market-leading high-speed SerDes and other critical technologies on the latest process manufacturing nodes,” said Sandeep Bharathi, chief development officer at Marvell. “Our longstanding collaboration with TSMC plays a pivotal role in helping Marvell develop complex silicon solutions with industry-leading performance, transistor density, and efficiency.”
Breakthrough Innovations on the Marvell 2nm Platform
One of the standout features of Marvell’s 2nm platform is its 3D simultaneous bi-directional I/O, which operates at speeds of up to 6.4 Gbits/second. This innovation allows designers to connect vertically stacked die inside chiplets, doubling bandwidth or reducing the number of connections by 50% compared to traditional unidirectional I/O pathways.
The shift to 3D simultaneous bi-directional I/O offers significant advantages for chip designers:
- Increased Bandwidth: By enabling two-way communication, designers can achieve up to 2x higher bandwidth within the same footprint.
- Reduced Complexity: Fewer connections simplify design and improve reliability.
- Enhanced Flexibility: Designers can stack more die into taller configurations, paving the way for advanced 2.5D, 3D, and 3.5D devices that outperform traditional monolithic silicon while functioning as a single device.
These advancements are particularly crucial as the industry moves toward chiplet-based designs. With current photomask limitations constraining the size of individual chips, an estimated 30% of all advanced node processors are expected to adopt chiplet architectures. Marvell’s 2nm platform empowers designers to create increasingly sophisticated multi-die solutions that deliver superior capabilities.
Collaboration with TSMC: A Foundation for Success
Marvell’s success in developing its 2nm platform is deeply rooted in its collaboration with TSMC, the world’s leading semiconductor foundry. Leveraging TSMC’s state-of-the-art 2nm process and advanced packaging technologies, Marvell has achieved unprecedented levels of performance, transistor density, and energy efficiency.
“TSMC is pleased to collaborate with Marvell on the development of its 2nm platform and the delivery of its first silicon,” said Dr. Kevin Zhang, senior vice president of business development and global sales, and deputy co-chief operating officer at TSMC. “We look forward to our continued collaboration with Marvell to utilize TSMC’s best-in-class silicon technology process and packaging technologies to advance accelerated infrastructure for the AI era.”
Enabling Hyperscalers to Meet AI Demands
The Marvell 2nm platform addresses the growing need for scalable, high-performance infrastructure capable of supporting the demands of the AI era. By combining cutting-edge silicon technology with innovative architectural designs, Marvell empowers hyperscalers to:
- Boost Performance: Deliver higher compute power and faster data processing for AI workloads.
- Enhance Efficiency: Reduce power consumption and operational costs through advanced fabrication techniques.
- Optimize Economics: Enable cost-effective scaling of AI and cloud infrastructure.
Transforming the Future of Compute
As AI continues to reshape industries, the demand for advanced compute and networking solutions will only intensify. Marvell’s 2nm platform represents a significant step forward in meeting these challenges head-on. By providing hyperscalers and cloud service providers with the tools they need to build next-generation infrastructure, Marvell is not only driving technological progress but also unlocking new possibilities for businesses worldwide.
With its proven track record of innovation and strategic partnerships, Marvell is poised to remain at the forefront of the semiconductor industry. As the company continues to push the boundaries of what’s possible, its 2nm platform will play a pivotal role in shaping the future of AI, cloud, and accelerated infrastructure.
