Micron Breaks Ground on First-of-Its-Kind HBM Advanced Packaging Facility in Singapore to Drive AI Innovation
In a landmark move for the semiconductor industry, Micron Technology, Inc. (Nasdaq: MU) has broken ground on its new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore. The event was marked by a ceremony attended by prominent government officials, including Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, as well as leaders from the Singapore Economic Development Board (EDB) and JTC Corporation. This state-of-the-art facility will be the first of its kind in Singapore, solidifying the nation’s position as a global hub for semiconductor innovation and advanced manufacturing.
A Strategic Investment to Meet Growing AI Demands
The demand for advanced memory solutions is skyrocketing as artificial intelligence (AI) adoption expands across industries. Recognizing this trend, Micron’s investment of approximately US $7 billion (SG$9.5 billion) in the HBM advanced packaging facility underscores its commitment to addressing the growing needs of AI-driven applications. Operations at the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity expected to ramp up by 2027.
“AI adoption is proliferating across industries, and the demand for advanced memory and storage solutions will continue to grow robustly,” said Sanjay Mehrotra, President and CEO of Micron. “With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.”
The facility will play a pivotal role in bolstering Singapore’s semiconductor ecosystem while contributing to global AI growth. By producing cutting-edge HBM solutions, Micron aims to meet the escalating demands of data-intensive applications, from AI and machine learning to cloud computing and high-performance computing (HPC).
Job Creation and Economic Impact
Micron’s investment is set to create significant economic opportunities in Singapore. Initially, the project will generate around 1,400 jobs, with plans to expand to an estimated 3,000 roles in the future. These positions will span a variety of functions, including packaging development, assembly, and test operations. The influx of skilled jobs will not only bolster Singapore’s workforce but also enhance its reputation as a leader in advanced manufacturing and technology innovation.
Png Cheong Boon, Chairman of the Singapore Economic Development Board, expressed his enthusiasm for the project: “We welcome this significant investment by Micron, which reflects its confidence in Singapore’s competitiveness as a critical node in the global semiconductor supply chain. This is Singapore’s first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth. It expands Singapore’s partnership with Micron and further strengthens the semiconductor ecosystem in Singapore.”
Aligning with Sustainability Goals
As part of Micron’s commitment to sustainability, the new facility will incorporate advanced technologies designed to minimize environmental impact. Key features include:
- Greenhouse gas abatement systems to reduce emissions.
- Water recycling initiatives to conserve resources.
- Waste circularity practices such as reducing, reusing, recycling, and recovering materials.
The facility will also leverage AI-based intelligent solutions to achieve high levels of automation, ensuring operational efficiency while minimizing energy consumption. Designed to meet Leadership in Energy and Environmental Design (LEED) certification requirements, the building exemplifies Micron’s dedication to sustainable manufacturing practices.
This aligns with Micron’s broader sustainability goals, building on the achievements of its existing Singapore facility. Notably, Micron’s current fab in Singapore is the first front-end semiconductor fab in the world to be recognized as both an Advanced Fourth Industrial Revolution Lighthouse and a Sustainability Lighthouse by the World Economic Forum.
Supporting Long-Term Manufacturing Needs
In addition to advancing HBM production, Micron’s expansion plans in Singapore will also address long-term manufacturing requirements for NAND memory. The company will maintain flexibility in managing the pace of capacity ramps for both HBM and NAND facilities to align with market demand, ensuring optimal resource allocation and responsiveness to industry trends.
Reinforcing Singapore’s Role in the Global Semiconductor Supply Chain
The launch of Micron’s HBM advanced packaging facility highlights Singapore’s strategic importance in the global semiconductor ecosystem. As a hub for innovation and advanced manufacturing, Singapore continues to attract significant investments from industry leaders like Micron. This project not only strengthens Micron’s presence in the region but also reinforces Singapore’s role as a key contributor to the future of AI and semiconductor technologies.
About Micron Technology, Inc.
Micron Technology, Inc. is a global leader in innovative memory and storage solutions that transform how the world uses information to enrich life for all. With a relentless focus on customer satisfaction, technology leadership, and operational excellence, Micron delivers a comprehensive portfolio of high-performance DRAM, NAND, and NOR memory products through its Micron® and Crucial® brands. Every day, Micron’s innovations fuel the data economy, enabling breakthroughs in AI, cloud computing, and compute-intensive applications—from data centers to intelligent edge devices and beyond.
To learn more about Micron Technology, Inc., visit micron.com.
