OKI Circuit Technology Unveils Breakthrough Simulation for High-Speed PCBs
OKI Circuit Technology (OTC), a subsidiary of the OKI Group and a leader in advanced printed circuit board (PCB) solutions, has announced the development of High-Accuracy Simulation Technology for High-Frequency Vias. This cutting-edge innovation enables precise control of via characteristics in 1.6 Tbps-class high-speed transmission PCBs, addressing the growing demands of next-generation AI data centers. By leveraging simulation-based design that integrates in-house manufacturing processes, OTC is poised to shorten development cycles and accelerate mass production timelines for customers’ high-performance PCBs.
The rapid evolution of generative AI systems has driven unprecedented demand for faster, higher-capacity AI servers, semiconductors, and data centers. As these systems scale, the PCBs used in their construction have become increasingly complex, multilayered, and densely packed. High-speed signal transmission within these PCBs relies heavily on vias—the structural transition points that electrically connect different layers. However, as frequencies rise, vias introduce challenges such as transmission losses and signal reflections, which can degrade performance. Controlling via characteristic impedance—a key factor in minimizing signal reflection—has thus become a critical technology for ensuring reliable high-speed transmission.
To meet these challenges, highly accurate via modeling is essential for Signal Integrity (SI) simulation, a process used during the PCB design stage to verify final signal quality. However, conventional modeling methods struggle to account for the intricate effects of manufacturing processes, material properties, and variations at high-frequency bands exceeding 50 GHz. This often results in simulation outputs that fail to correlate with actual measured characteristics, creating significant obstacles for designers.
OTC’s new High-Accuracy Simulation Technology for High-Frequency Vias addresses this issue head-on. By integrating decades of accumulated evaluation data, OTC has built a proprietary database of parameters, including finished dimensions, manufacturing tolerances, and material properties. Using advanced 3D electromagnetic field analysis tools, the technology models vias with exceptional precision, ensuring that simulated results closely match real-world performance.
Before PCB fabrication begins, OTC uses this technology to comprehensively evaluate and optimize via structures, dimensions, and manufacturing margins. By aligning simulations with the capabilities of its factories’ production lines, OTC extracts optimal conditions that meet stringent signal quality requirements. This approach not only enhances design accuracy but also reduces the need for costly and time-consuming trial-and-error adjustments during production.
Enabling Next-Generation AI Infrastructure
The increasing complexity of via structures further underscores the importance of OTC’s breakthrough. In addition to traditional through vias that connect the front and back sides of a PCB, modern designs often incorporate non-through vias and build-up vias, which connect specific inner layers or are formed layer-by-layer. These structures demand meticulous optimization to ensure consistent performance across all layers.
By enabling precise control of via characteristics, OTC’s simulation technology supports the development of PCBs capable of handling the extreme speeds and densities required by AI-driven applications. This capability is particularly crucial for next-generation AI data centers, where high-speed transmission is vital for processing massive datasets and delivering real-time insights.
Showcasing Innovation at SWTest Asia 2025
OTC will showcase its groundbreaking simulation technology at SWTest Asia 2025, Asia’s premier conference dedicated to semiconductor testing and wafer-level technologies. The event, scheduled from November 20 to 22, 2025, at the Hilton Fukuoka Sea Hawk, will feature OTC’s booth (#512). Attendees will have the opportunity to learn more about how OTC’s innovations are shaping the future of high-speed PCB design and supporting the scalability of AI infrastructure.
Addressing Key Challenges in High-Frequency PCB Design
The development of OTC’s simulation technology addresses several critical challenges in high-frequency PCB design:
- Via Impedance Control: Accurate modeling ensures minimal signal reflection, preserving signal integrity even at frequencies exceeding 50 GHz.
- Manufacturing Process Integration: By accounting for real-world manufacturing variations, the technology bridges the gap between simulation and actual product performance.
- Material Property Optimization: Parameters such as relative permittivity, dielectric loss tangent, and conductor surface roughness are meticulously analyzed to achieve reliable results.
These advancements not only enhance the quality of high-speed PCBs but also streamline the development process, reducing time-to-market for customers operating in fast-paced industries like AI and telecommunications.
A Foundation for Future Innovations
As AI continues to drive demand for faster, more efficient computing systems, the role of high-speed PCBs becomes increasingly critical. OTC’s High-Accuracy Simulation Technology for High-Frequency Vias represents a significant leap forward in addressing the complexities of modern PCB design. By combining advanced simulation tools with deep expertise in manufacturing processes, OTC is empowering customers to push the boundaries of what’s possible in high-speed transmission.
Looking ahead, OTC remains committed to advancing its capabilities and expanding its contributions to the global electronics industry. With this new technology, the company is well-positioned to support the ongoing transformation of AI data centers and other high-performance computing environments.
For more information about OTC’s innovations and its participation in SWTest Asia 2025, visit their official website or contact their team directly.
About Oki Electric Industry (OKI)
Founded in 1881, OKI is Japan’s leading information and telecommunication manufacturer. Headquartered in Tokyo, Japan, OKI provides top-quality products, technologies, and solutions to customers through its Public Solutions, Enterprise Solutions, Component Products, and Electronics Manufacturing Services businesses. Its various business divisions function synergistically to bring to market exciting new products and technologies that meet a wide range of customer needs in various sectors. Visit OKI’s global website at https://www.oki.com/global/.
