SK hynix to Showcase Groundbreaking AI Memory Solutions at CES 2025: Pioneering the Future as a Full Stack AI Memory Provider
SK hynix Inc. (www.skhynix.com), a global leader in semiconductor technology, has announced its participation in CES 2025, set to take place in Las Vegas from January 7 to 10. The company will unveil its cutting-edge AI memory technologies, reinforcing its vision as a Full Stack AI Memory Provider. This concept reflects SK hynix’s commitment to delivering comprehensive AI-related memory products and solutions, spanning on-device AI, next-generation AI memory innovations, and flagship products like HBM (High Bandwidth Memory) and eSSD (Enterprise Solid-State Drives).
A Strategic Presence at CES 2025
SK hynix’s leadership team, including CEO Kwak Noh-Jung, CMO Justin Kim, and Chief Development Officer (CDO) Ahn Hyun, will attend the event to highlight the company’s technological advancements. “At CES 2025, we aim to introduce optimized solutions for on-device AI and next-generation AI memory while showcasing our industry-leading products,” said Justin Kim. “This is an opportunity to demonstrate our technological competitiveness and establish SK hynix as a key player in shaping the future of AI memory.”
The company will also participate in a joint exhibition booth with other SK Group affiliates, including SK Telecom, SKC, and SK Enmove, under the theme “Innovative AI, Sustainable Tomorrow.” The booth will feature immersive displays illustrating how SK Group’s AI infrastructure and services are transforming industries, symbolized by waves of light representing innovation and sustainability.
Revolutionary AI Memory Products on Display
SK hynix will showcase several groundbreaking products, underscoring its leadership in AI memory technology:
HBM3E 16-Layer: Pushing the Boundaries of Performance
As the first company to mass-produce 12-layer HBM products for the 5th generation, SK hynix will display samples of its newly developed HBM3E 16-layer product. Leveraging the advanced MR-MUF process, this product achieves the industry’s highest layer configuration while controlling chip warpage and maximizing heat dissipation. These innovations make it an ideal solution for high-performance AI data centers and next-generation computing systems.
Enterprise SSDs: High Capacity and Efficiency
The company will also exhibit high-capacity, high-performance enterprise SSDs, including the D5-P5336 122TB model developed by its subsidiary, Solidigm. This product stands out for its record-breaking capacity, exceptional power efficiency, and space-saving design, making it a top choice for AI data center customers.
Furthermore, SK hynix recently achieved a milestone by developing QLC (Quadruple Level Cell)-based 61TB SSDs in December. According to Ahn Hyun, CDO at SK hynix, “Our QLC-based products, combined with Solidigm’s expertise, will create a balanced portfolio that maximizes synergy in the high-capacity eSSD market.”
On-Device AI Innovations
To address the growing demand for AI capabilities in edge devices, SK hynix will present innovative on-device AI solutions such as LPCAMM2 and ZUFS 4.0:
- LPCAMM2 (Low Power Compression Attached Memory Module 2): This LPDDR5X-based module offers superior power efficiency, high performance, and significant space savings. It can replace two DDR5 SODIMMs with a single LPCAMM2 module, making it ideal for compact devices like laptops and smartphones.
- ZUFS 4.0 (Zoned Universal Flash Storage): A NAND flash product designed to optimize data management by grouping similar data into specific zones. This approach enhances efficiency in data transfer between operating systems and storage devices, benefiting applications in digital cameras, mobile phones, and other electronic devices.
Next-Generation Data Center Technologies
SK hynix is also advancing next-generation data center infrastructures with its CXL (Compute Express Link) and PIM (Processing in Memory) technologies. Modular versions of these innovations, including CMM-Ax (CXL Memory Module-Ax) and AiMX (Accelerator-in-Memory based Accelerator), will be showcased at the event.
- CMM-Ax: This groundbreaking product combines the high-capacity memory expansion capabilities of CXL with computational functionality, significantly improving the performance and energy efficiency of server platforms.
- AiMX: An accelerator card powered by GDDR6-AiM chips, AiMX specializes in handling large language models and other AI workloads, offering unparalleled processing power for complex applications.
HBM4 and Beyond
CEO Kwak Noh-Jung emphasized SK hynix’s ongoing commitment to innovation, stating, “The rapid evolution of AI is expected to accelerate further in 2025. To meet the diverse needs of our customers, SK hynix plans to begin production of 6th generation HBM (HBM4) in the second half of this year. We will continue to push the boundaries of AI memory technology, providing irreplaceable value to our customers.”
Availability and Future Prospects
SK hynix’s CES 2025 showcase underscores its role as a trailblazer in AI memory solutions. By combining cutting-edge hardware with forward-thinking software integration, the company is poised to lead the global transition to AI-driven computing. Visitors to the event will have the opportunity to explore SK hynix’s latest innovations and gain insights into the transformative potential of AI memory technologies.
As SK hynix continues to innovate, its vision as a Full Stack AI Memory Provider promises to reshape industries, empower businesses, and drive sustainable growth in the AI era. Stay tuned for more updates as SK hynix unveils new possibilities through technological breakthroughs.
