Texas Instruments Unveils World’s Smallest MCU, Revolutionizing Space-Constrained Designs
In a groundbreaking announcement, Texas Instruments (TI) (Nasdaq: TXN) has introduced the world’s smallest microcontroller unit (MCU), expanding its robust Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring just 1.38mm², roughly the size of a black pepper flake, this innovative wafer chip-scale package (WCSP) for the MSPM0C1104 MCU is designed to optimize board space in compact applications such as medical wearables, personal electronics, and other space-constrained devices without compromising performance.
“In tiny systems like earbuds and medical probes, board space is a scarce and valuable resource,” said Vinay Agarwal, Vice President and General Manager of MSP Microcontrollers at TI. “With the addition of the world’s smallest MCU, our MSPM0 MCU portfolio provides unlimited possibilities to enable smarter, more connected experiences in our day-to-day lives.”
Tiny Package, Big Possibilities
As consumer demand grows for smaller, feature-rich electronic devices—such as electric toothbrushes, stylus pens, and smart wearables—engineers face the challenge of integrating advanced functionality into shrinking footprints. The MSPM0C1104 MCU addresses this need by leveraging WCSP technology, intentional feature selection, and TI’s cost optimization strategies. At just 1.38mm², the eight-ball WCSP is 38% smaller than competing devices, making it ideal for compact designs.
The MSPM0C1104 MCU features:
- 16KB of memory
- A 12-bit analog-to-digital converter (ADC) with three channels
- Six general-purpose input/output (GPIO) pins
- Compatibility with standard communication interfaces like UART, SPI, and I²C
By integrating high-speed, accurate analog components into the world’s smallest MCU, engineers can maintain the computing performance of their embedded systems without increasing board size. This flexibility empowers designers to innovate in space-constrained applications while enhancing functionality and reducing costs.
To explore how small-size packaging and integration optimize designs, read TI’s technical article: “Tiny, but Mighty: How Small-Size Packaging and Integration for MCUs Help Optimize Space-Constrained Designs.”
Scalability Across Applications with a Single MCU Portfolio
The MSPM0C1104 MCU joins TI’s comprehensive MSPM0 MCU portfolio, which offers scalability, cost efficiency, and ease of use to accelerate time-to-market. With over 100 cost-effective MCUs, the portfolio includes pin-to-pin compatible package options and feature sets tailored to meet memory, analog, and computing requirements across personal electronics, industrial, and automotive applications.
Starting at just $0.16 in 1,000-unit quantities, the portfolio includes various small packages that help reduce board size and bill-of-materials costs. This optimization enables engineers to design products of any size while minimizing complexity and expense in their systems.
Comprehensive Ecosystem for Streamlined Development
TI supports its MSPM0 MCU portfolio with a robust ecosystem designed to simplify development and accelerate innovation. Key resources include:
- Optimized Software Development Kit (SDK): Enables seamless configuration, development, and deployment of MCU applications.
- Hardware Development Kits: Facilitate rapid prototyping with tools like the MSPM0C1104 LaunchPad™ development kit, available for $5.99 on TI.com.
- Reference Designs and Subsystems: Provide code examples for common MCU functions, reducing development time.
- Zero Code Studio Tool: Allows users to configure, develop, and run MCU applications in minutes without writing code.
This ecosystem empowers engineers to scale designs and reuse code across projects, minimizing hardware and software modifications. Additionally, TI’s growing investments in internal manufacturing capacity ensure reliable supply chain support for future demand.
Showcasing Innovation at Embedded World 2025
At Embedded World 2025 (March 11-13, Nuremberg, Germany), TI will demonstrate how its technologies are redefining embedded systems to create a smarter, more connected world. Visitors to Hall 3A, Booth No. 131, can explore advancements in real-time monitoring, edge AI, IoT connectivity, and open-source software development.
Highlights from TI’s presentations include:
- March 11: TI Chief Technology Officer Ahmad Bahai, Ph.D., participates in “C-Level @ Embedded World,” while Nitika Verma presents “Network Traffic Tunneling on Heterogeneous SoCs.”
- March 12: Daolin Qiu discusses “Time Synchronization over Network Redundancy in Real-Time Applications.”
- March 13: Multiple sessions cover topics like audio solutions, boot time optimization, and mmWave radar prototyping.
For more details, visit ti.com/EW.
Availability and Pricing
Preproduction quantities of the MSPM0C1104 MCU are now available on TI.com, with pricing starting at $0.20 in 1,000-unit quantities. Multiple payment and shipping options are available to meet diverse customer needs.
Pioneering the Future of Compact Electronics
The introduction of the world’s smallest MCU underscores TI’s commitment to innovation in embedded systems. By combining ultra-compact packaging, advanced features, and cost efficiency, the MSPM0C1104 MCU empowers engineers to push the boundaries of what’s possible in space-constrained designs. Whether it’s enhancing medical wearables, personal electronics, or industrial applications, TI’s MSPM0 MCU portfolio delivers unmatched scalability, performance, and flexibility.
Stay tuned for updates as TI continues to lead the charge in transforming the embedded systems landscape. For more information, visit TI’s official website and discover how these cutting-edge MCUs can elevate your next design.
