Oracle Adds New Fusion Agentic Applications to Help Customers Improve Supply Chain Performance Oracle today announced four new Fusion Agentic Applications that will help organizations improve supply chain performance by increasing inventory visibility, reducing supplier and operational impact, and improving manufacturing efficiency.…
Claude Meets Blackwell Ultra: Anthropic’s Models Now Run on NVIDIA GB300 in Azure Anthropic’s Claude models in Microsoft Foundry — hosted on Microsoft Azure and running on NVIDIA GB300 Blackwell Ultra GPUs — are now generally available, giving Azure-native enterprises a…
Samsung Introduces New Education Tools for Interactive Displays at ISTELive 26 Samsung Electronics today announced new education solutions for its Android-based Samsung Interactive Display lineup, making shared classroom displays easier to personalize and manage. Announced and exhibited at ISTELive 26,…
Optimizing the Nano-TSV-to-BPR Connection in Backside Power Networks As technology nodes continue to scale, maintaining power and performance while reducing the footprint has become increasingly challenging. Backside power delivery networks (BSPDNs) address this challenge by moving the power delivery network…
Palantir and Surf Air Mobility Expand Partnership to Accelerate Commercialization of OperatorOS, OwnerOS, and Enterprise Products Palantir Technologies Inc. today announced an expansion of its partnership with Surf Air Mobility Inc. (“Surf Air Mobility”), a leading air mobility platform. Under…
ServiceNow and Accenture launch AI-powered services to accelerate the shift from legacy risk platforms to agentic AI Accenture and ServiceNow, the AI control tower for business reinvention, today launched a joint offering with two core components: managed security services built on the…
Samsung Unveils 2026 Sustainability Report with Expanded Water Restoration Initiatives The report details Samsung’s key environmental, social and governance strategies and achievements as the company works to fulfill its corporate responsibilities and build a foundation for sustainable growth amid evolving…
Key takeaways: Artificial intelligence is rewriting the rules of advanced packaging. Larger dies, denser interconnects, and increasingly complex architectures are moving rapidly from roadmap to reality. As these designs push beyond the physical limits of traditional wafers, panel-level packaging is…
At VLSI 2026, the premier IEEE conference for microelectronics technology and circuits, one message stood out: in the AI era, scaling compute challenges span the entire stack—from systems to devices, memory, packaging, and manufacturing. That’s why Applied Materials convened its…
As AI infrastructure fragments into specialized tiers, CPUs are becoming the orchestration layer for agentic workloads AI infrastructure is entering a crucial new phase. The first phase of generative AI infrastructure was defined by accelerator scale: how many GPUs, NPUs…
eloitte, IBM (NYSE: IBM), and Red Hat announced a collaboration to help protect the software supply chain against increasingly automated cyber threats. Deloitte joins the initiative as an integration collaborator for Lightwell, bringing its broader secured software supply chain architecture and cyber…
Highlights: Qualcomm Technologies, Inc. (NASDAQ: QCOM) and Meta today announced a strategic multi-generation collaboration for Qualcomm Technologies to be a supplier for data center CPUs for Meta. Qualcomm Technologies’ data center CPU, the Qualcomm Dragonfly™ C1000, is planned to power Meta’s…